The Ultrasonic Industry Association, like almost all other associations, had to reposition its annual gathering designed to share ideas, latest advances and provide networking opportunities.
The UIA board recognizes that one of the most helpful components of the annual symposium is the “unconference” portion - the opportunity for individuals deeply involved in the ultrasonic applications and research to discuss the applicability of information to their needs.
In response to this need - which is still as vital as ever - the UIA Board is establishing a Virtual Collaboration, designed to provide ultrasound information and the opportunity for small groups to discuss ways that this information can be successfully implemented.
Virtual Connections will be held every other month to encourage sharing of ideas among members that has been a hallmark of the UIA Symposium.
Virtual Collaborations - 12 November 2020 at 10 am EST / 3 pm BT
Multi-wavelength Probes and Blades: Tuning / Gain / Balancing
The next Virtual Collaborations will be presented by Jeff Vaitekunas, Ph.D., Assistant Professor, Penn State Behrend.
This edition of Virtual Collaborations will be available to UIA members at $50 / students at $25 / nonmembers at $75.
The first Virtual Collaboration was held on Thursday, 24 September 2020
Jay Sheehan lead the first Virtual Connection with his presentation on Piezo Stack Preload in Transducers.
The program begins with a presentation on preload basics, mechanical elements and analysis, pressure FEA, effects on piezo properties, and applying preload in practice.
One of my favorite aspects of Ultrasonic Industry Association symposiums is the collaboration that occurs during breaks in the actual symposium presentations. Ultrasonic technology is highly non-linear and often confounding, and bouncing thoughts with peers is practically impossible on a day to day basis due to the significant intellectual investment necessary to understand the issues. With the current pandemic, it is not feasible for many to meet in person and have these collaborations. That is why I am looking forward to the UIA’s virtual collaboration on applying pre-load to Langevin-type piezoelectric transducers. Over the years I have experienced several instances of pre-load issues that at the time were confusing, but with hindsight are completely understandable. These collaborative discussions provide the insight needed to overcome common issues that are otherwise difficult to comprehend.
Jeff Vaitekunas Ph.D.
Assistant Professor, Penn State Behrend